发明名称 RESIN COMPOSITION, RESIN SHEET, RESIN CURED ARTICLE, AND RESIN SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a resin composition capable of providing excellent thermal characteristics.SOLUTION: A resin composition contains an epoxy compound and a triphenyl benzene compound. The triphenyl benzene compound is a compound containing 1,3,5-triphenyl benzene as a skeleton and reactive groups introduced to the skeleton. The content of 1,3,5-triphenyl benzene in all organic products is 5 mass% or more and less than 15 mass%.
申请公布号 JP2016204605(A) 申请公布日期 2016.12.08
申请号 JP20150091611 申请日期 2015.04.28
申请人 TDK CORP 发明人 YAMASHITA MASAAKI;SUGIYAMA TSUYOSHI;SHUTO HIROSHI
分类号 C08G59/62;B32B27/38;C08G59/50;C08K5/13;C08K5/18;C08L63/00 主分类号 C08G59/62
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