发明名称 |
RESIN COMPOSITION, RESIN SHEET, RESIN CURED ARTICLE, AND RESIN SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition capable of providing excellent thermal characteristics.SOLUTION: A resin composition contains an epoxy compound and a triphenyl benzene compound. The triphenyl benzene compound is a compound containing 1,3,5-triphenyl benzene as a skeleton and reactive groups introduced to the skeleton. The content of 1,3,5-triphenyl benzene in all organic products is 5 mass% or more and less than 15 mass%. |
申请公布号 |
JP2016204605(A) |
申请公布日期 |
2016.12.08 |
申请号 |
JP20150091611 |
申请日期 |
2015.04.28 |
申请人 |
TDK CORP |
发明人 |
YAMASHITA MASAAKI;SUGIYAMA TSUYOSHI;SHUTO HIROSHI |
分类号 |
C08G59/62;B32B27/38;C08G59/50;C08K5/13;C08K5/18;C08L63/00 |
主分类号 |
C08G59/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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