发明名称 THERMOSETTING RESIN COMPOSITION AND CURED FILM THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for preparing a cured film by heating.SOLUTION: A thermosetting resin composition comprises (c) a polymer obtained by the radical polymerization of (a) a compound having a trifunctional or more polymerizable double bond in the presence of (b) a chain transfer agent.SELECTED DRAWING: None
申请公布号 JP2016216647(A) 申请公布日期 2016.12.22
申请号 JP20150104566 申请日期 2015.05.22
申请人 JNC CORP 发明人 MEGURO SATOSHI;KAMEI YUSUKE;KIMURA YUKI
分类号 C08L47/00;C08F2/38;C08F36/22 主分类号 C08L47/00
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