| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film capable of cutting a film only with an expansion, and enabling improvement of yield and reduction of shortening of manufacturing tact in a manufacturing process of a thin chip.SOLUTION: There is provided an adhesive film having breaking elongation rate at 0°C before curing of 2 to -8%, shear viscosity at 120°C of 3,000 to 10,000 Pa s and storage elastic modulus at 150°C after heating at 150°C for 1 hour of 10 MPa or more. There is provided an adhesive film having thickness of the adhesive film of 3 to 40 μm. There is provided an adhesive film having adhesion force between a semiconductor wafer and the adhesive film of 250 N/m or more when laminating the adhesive film to the semiconductor film.SELECTED DRAWING: None |
