SUBSTRATE TREATING APPARATUS AND TREATMENT GAS SUPPLYING NOZZLE

摘要

Substrate treating apparatus including a cover that covers a substrate on a plate. The cover undersurface is substantially horizontal and adjacent to a surface of the substrate. Through a gas flow path, a treatment gas is supplied to the substrate. The gas flow path includes a swirl chamber, a diameter contraction chamber, and a diameter expansion chamber. In the swirl chamber, the treatment gas flows around the central axis. The diameter contraction chamber is disposed below and in communication with the swirl chamber, and has an inner diameter that decreases from its upper end toward its lower end. The diameter expansion chamber is disposed below and in communication with the diameter contraction chamber, and has an inner diameter that increases from its upper end toward its lower end. The lower end of the diameter expansion chamber includes an opening on the undersurface of the cover.

主权项

1. A substrate treating apparatus, comprising:
a plate that places a substrate thereon substantially horizontally; and a cover that covers an upper side of the substrate on the plate, the cover comprising:
an undersurface that is substantially horizontal and adjacent to a surface of the substrate; anda gas flow path through which a treatment gas is supplied to the substrate, the gas flow path comprising:
a swirl chamber having a cylindrical shape with a substantially vertical central axis, and in which the treatment gas flows around the central axis;a diameter contraction chamber disposed below the swirl chamber and in communication with the swirl chamber, and whose inner diameter decreases from its upper end toward its lower end; anda diameter expansion chamber disposed below the diameter contraction chamber and in communication with the diameter contraction chamber, whose inner diameter increases from its upper end toward its lower end, and the lower end of the diameter expansion chamber includes an opening on the undersurface of the cover.