| 摘要 |
<p>A compsn. for removing photoresist resins comprises a solvent from tetrahydronaphthalene (I) and/or cyclohexanone (II) and pref. also an acidic cpd. Pref. (I) and (II) are both present in wt. ratio 90/10 to 10/90, esp. 50/50 to 80/20. The acidic cpd. is pref. a chloroacetic, oxalic, lactic, salicylic, ascorbic, citric, 2-15C alkyl benzenesulphonic acid or 2-20C alkyl phosphate acid, used in amt. of less than 30, (11-30)%. The compsn. has low volatility and/or toxicity.</p> |
