Component mounting equipment for printed circuit board - includes baffles fitted between heat generating components to divert cooling air flow

摘要

The method of mounting components in rows on printed circuit plates is combined with a cooling system in which cooling air is blown over the plate and the components attached to it. Short baffles (1) can be inserted between selected components where heat is generated by current through the components. Each baffle can consist of a body made of a heat resisting flexible plastics material with supporting legs (2) projecting downwards from it. Each body has at least one guide groove (3) along its side. A body can be bent round to protect two sides at right angles.