| 摘要 |
<p>A structured copper strain buffer, which is thermally and electrically conductive is provided for use with semiconductor electronic devices. A thermocompression diffusion bond is used to attach a metallic foil two a structured copper disk to form the strain buffer. The individual strands of copper within the strain buffer are capable of independent movement. The structured copper strain buffer provides a means of attachment to a semiconductor device without causing a stress to be generated at the attached surface of the device as the device expands and contacts with temperature changes.</p> |
