Device for heat-bonding utilizing temperature-controlled pressure.

摘要

Two items (10, 11) having surfaces to be bonded together are held together with a heat-bonding adhesive distributed between the surfaces to be bonded. At least one of the items (10) is backed by a pressure-applying pad (12) comprising an elastomeric or synthetic polymer compound having a relatively high coefficient of heat expansion, a yield strength lower than that of the items to be bonded and a deforming temperature higher than that required to activate the adhesive. The items (10, 11) and the backing pad (12) are held together in a holder (15, 16) while sufficient heat is applied to them to activate the adhesive.