| 摘要 |
PURPOSE:To perform the cleaning and shaping of the bonding tool of a tape bonder in complete automation and to enable to improve the workability of the tape bonder by a method wherein the tape bonder is provided with an X-Y table whereon a metal brush and a fixed lapping machine are placed. CONSTITUTION:A semiconductor pellet 3 is placed on a stage 2 and the pellet 3 is positioned under the lead 5 of a film carrier by revolving a pellet feeding table 1. The pellet 3 and the lead 5 are thermally pressure welded by a bonding tool 6. The bonding tool 6 is made to shift to its backward position and the bonding surface of the tool 6 is made to come into contact to a rotating metal brush 13 for performing cleaning. According to need, an X-Y table 10 is made to shift, the tool 6 is made to come into contact to a fixed lapping machine 16 and the bonding surface is lapped for performing flat work.
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