发明名称 Method of manufacturing a semiconductor device
摘要 A method of manufacturing a semiconductor device which comprises the step of applying a silicon carbide film having a prescribed perforated pattern as a masking film selectively to etch a silicon dioxide film or diffuse an impurity into a substrate.
申请公布号 US4560642(A) 申请公布日期 1985.12.24
申请号 US19840632239 申请日期 1984.07.19
申请人 TOYKO SHIBAURA ELECTRIC CO 发明人 YONEZAWA, TOSHIO;AJIMA, TAKASHI;HIRAKI, SHUNICHI;KOSHINO, YUTAKA;OKA, YOSHITAMI
分类号 H01L21/033;H01L21/311;H01L21/314;(IPC1-7):B05D1/32 主分类号 H01L21/033
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