发明名称 |
Package and method of manufacturing the same |
摘要 |
<p>The present invention provides a package whose heat dissipation performance by a semiconductor device has been improved, which synchronizes with the rapid development of high transmission density in multiplex communications. In place of the conventional package substrate, a substrate formed by a combination of two or more kinds of materials is used, whereby the temperature of a portion at which the temperature tends to rise to become extremely high within the package is selectively dissipated, whereby the heat dissipation performance of the package is efficiently improved. A diamond coated substrate or diamond substrate is used at a portion with an extremely high temperature for dissipating the heat.
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申请公布号 |
EP1130644(A3) |
申请公布日期 |
2008.02.13 |
申请号 |
EP20010301931 |
申请日期 |
2001.03.02 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
OOE, SATOSHI;YAMAMOTO, YOSHIYUKI |
分类号 |
H01L23/12;H01L23/373;H01L23/08;H01L23/36;H01L23/498 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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