| 摘要 |
PURPOSE:To limit a crack directed toward the surface by providing an acute projection formed by a slope on the side perpendicular to the thicknesswise direction of a chip placing unit, direction the projection to the thick side of a package resin and forming the corner of the side disposed at a thin side at an obtuse angle. CONSTITUTION:A semiconductor device 10 has an acute projection 15 formed of a slope 14 on the side perpendicular to the thicknesswise direction of a chip placing unit 12a of a lead frame 12. This slope 14 is formed at an acute angle at the inside corner formed between one end, i.e., the main surface of the unit 12a and hence the placing surface and he slope 14, and at an obtuse angle at the inside corner formed between the other main surface of the unit 12a, i.e., the back surface and the slope 14. The projection 15 is formed at the thick side of enclosing resin 11. The generating direction of a crack 16 from the projection 15 is not directed to the upper surface 11a of the package, but extended in the direction substantially parallel to the upper surface 11a, and terminated at the interior of the package. |
