| 摘要 |
PURPOSE:To polish a wafer into mirror-finishing, by setting up the wafer and an abrasive plate provided with a window transmitting light so as to be opposed via a chemical solution, while making the wafer and the abrasive plate perform their relative motion via the chemical solution while irradiating the light to the chemical solution and the wafer through the said window. CONSTITUTION:A wafer 2 is pressed to an abrasive plate 5 with a pressure of about 10g/cm<2>, and the wafer 2 and the abrasive plate 5 are rotated in an arrow direction via a chemical solution 8 kept in a tank 6 while irradiating ultraviolet rays 9 on a polishing surface of the wafer 2 through each window 4 of the abrasive plate. with this operation, the wafer 2 and the abrasive plate 5 start their relative motion, thus the wafer is polished. With irradiation of the ultraviolet rays 9, the wafer and/or the chemical solution 8 come into a state of being excited and activated, therefore they are easy to react so that a reaction velocity goes up and, what is more, a surface of the water 2 is subjected to friction, thus the surface is mechanically processed so smooth enough, making a removal rate increasable while polishing the wafer into mirror-finishing.
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