PRODUCTION OF OPTICAL SEMICONDUCTOR MODULE

摘要

PURPOSE:To provide excellent stability and airtightness to an optical semiconductor module and to lessen the thermal influence on an optical semiconductor element by the simplified module structure and the shortened fixing operation in the stage of packaging an optical fiber to a package by locally heating and calcining a low m.p. glass material by a CO2 laser, etc. thereby airtightly fixing the optical fiber to the package. CONSTITUTION:A heat sink 7 and an LD element 6 are bonded successively to the package 8 and electric terminals 11 are wired. The LD is made to emit light and the optical fiber 9 is finely adjusted and positioned to maximize the input power to the optical fiber. The low m.p. glass paste (in the liquid state) is poured into a fixing part 10 and, for example, the CO2 laser beam (10.6mum wavelength) is condensed from above to heat and calcine the low m.p. glass, by which the fiber 9 is fixed. A cap 12 is joined to the package 8 by a method such as soldering and the entire part is hermetically sealed.