发明名称 PLATING METHOD FOR VERY SMALL PART OF CONNECTOR TERMINAL
摘要 PURPOSE:To efficiently subject the parts to be plated of a very small area to an electroplating treatment by moving a connector terminal in such a manner that a pair of the right and left projecting parts to be plated at the top end of the connector terminal sandwich a plating liquid supplying body. CONSTITUTION:A pair of the right and left projecting parts 11 to be plated of the connector terminal 10 which is made cathode are moved in contact with or proximity to a plating liquid bleeding body 16 of the plating liquid supplying body 13. On the other hand, a prescribed pressure is exerted to the plating liquid 18 in a plating liquid supplying box 12 to raise the plating liquid 8 in a passage 14. The plating liquid flows out of a plating liquid supplying hole 17 at the top of a support 15 and enters the mesh of the plating liquid bleeding body 16 so as to have the bleeding state. The parts 11 to be plated, therefore, contact the plating liquid 18 of the body 16 and the transfer and reception of the plating liquid 18 are executed. The parts 20 near the projecting ends of the parts 11 to be plated and upper and lower parts 21 adjacent thereto are thereby approximately uniformly plated when electricity is conducted to the connector terminal 10 and an anode 19.
申请公布号 JPS62211396(A) 申请公布日期 1987.09.17
申请号 JP19850250949 申请日期 1985.11.11
申请人 ELECTROPLATING ENG OF JAPAN CO 发明人 MURATA YASUTO;YAMAMOTO KENJI;TEZUKA JUNICHI
分类号 C25D5/02;H01R43/00 主分类号 C25D5/02
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