| 摘要 |
PURPOSE:To maintain the strength of dies and to provide a long lifetime of dies by a method wherein a protruding part is provided in the vicinity of the center part of the end faces facing each other of the dies, and cutting and bending forming are performed simultaneously using a bending punch and a cutting punch. CONSTITUTION:A die 3, on which protruding parts 7 symmetrical to the surface of a plate member will be formed, is arranged on the recess of the die holder 1 whereon a part 2 having alternately regular recesses and protrusions will be provided, and a pressure pad 4 is arranged in a cavity which will be provided on the protrusion 2 corresponding to said protruding part 7. After a plurality of leads 8 have been engaged on the protruding part 7 by placing a resin-sealed semiconductor device in the cavity to be formed thereon, the pressing tool, on which a bending punch and a cutting punch 9 taller and larger than the bending punch will be arranged alternately, is pressed to the leads 8. As a result, the leads 8 which are short in length are formed and processed, and as cutting and bending forming can be performed simultaneously in addition to the maintaining of strength of the die, the reduction both in manhours and cost of production can be accomplished.
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