| 摘要 |
PURPOSE:To make it possible to discriminate between defective and non- defective state of mounting of a semiconductor element, to reduce the material to be discarded and also to cut down the cost of production of the title semiconductor element by a method wherein the temperature of a semiconductor pellet is raised by giving a light pulse to the pellet, the surface temperature distribution is detected, and the value of thermal resistance is found out. CONSTITUTION:When the rays of light of an infrared ray lamp 1 are made to irradiate on a semiconductor pellet 5 intermittently, the temperature distribution on the surface of the semiconductor pellet is determined in the well balanced state between the temperature rise by the irradiation heat and the quantity of radiant heat dissipated to a substrate 6 from the semiconductor pellet 5 through solder 7. Said temperature distribution is detected by a non-contact type surface temperature sensor 8, and the defective or non-defective decision on the mounted state of the semiconductor pellet 5 is given by the image processing device 9 based on the temperature distribution pattern.
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