发明名称 COPPER ALLOY FOR LEAD MATERIAL OF SEMICONDUCTOR APPARATUS
摘要 PURPOSE:To satisfy the strength, heat resistance and bendability of the titled alloy and to remarkably improve the electrical (heat) conductivity of the same by adding the specific ratios of Sn and two kinds of Cr and rare earth elements to copper and regulating the O2 content to the specific value or below. CONSTITUTION:The titled alloy contains, by weight, 0.05-0.5% Sn, the total 0.01-0.3% of two kinds of Cr and rare earth elements, <=0.0010% O2 and the balance consisting of Cu. more specifically, the strength and heat resistance are improved without remarkably deteriorating the conductivity of electricity and heat characteristics of Cu by adding Sn to ordinary oxygen-free copper. At the same time, the strength and heat resistance are furthermore improved without excessively lowering the conductivity of electricity and heat by adding two kinds of Cr and rare earth elements. The oxidation of each element to be added is prevented and they act effectively owing to the regulation of the O2 content.
申请公布号 JPS63241129(A) 申请公布日期 1988.10.06
申请号 JP19880002263 申请日期 1988.01.08
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 YAMATO KOZO;AKASAKA KIICHI;SHINOZAKI SHIGEO;KUROYANAGI TAKU
分类号 C22C9/00;C22C9/02 主分类号 C22C9/00
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