| 摘要 |
PURPOSE:To contrive to facilitate the manufacture, to improve the quality and to attain thin profile of electronic components by accommodating an electronic component main body element in a package type resin-made case, fixing a cover of a metal-made with a gate for packing member opened to the rein- made case, injecting a fluid packing member from the gate of the packing member and curing the member into an elastic body in its inside. CONSTITUTION:An electronic component main body element 5 is accommodated in the resin-made case 2. Then the electronic component main body element 5 is connected electrically to lead terminals 3a, 3b or the like by conductive paste 4a, 4b. Then the metal-made cover 4 with the gates 7a, 7b for packing member formed thereto is placed on a step 2a of the resin-made case 2, the ridge 2b is heated to fix the resin-made case 2 and the cover 7. Moreover, a nozzle N for packing member dispenser is arranged to the packing member gate 7a and the fluid packing member is injected from the nozzle N. After proper amount of packing member is injected, the packing member is cured into the elastic body 6. Thus, the management of the quantity of packing is facilitated, the manufacture is facilitated and thin profile is attained for the product.
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