| 摘要 |
PURPOSE:To make it possible to remove easily a semiconductor chip by a method wherein a hole is provided in a part, which is bonded to the bottom surface of the chip, of a circuit board. CONSTITUTION:A semiconductor chip 3, which is provided with bonding pads 3a formed on its peripheral parts, is bonded on a circuit board 2; which is provided with conductor wiring patterns 1a formed on the peripheral parts of its surface, bonding pads 1b formed on the sides of the points of the patterns 1a and a penetrating circular hole 2a formed in its central part; with such a thermosetting bonding agent 4 as a silver paste and is arranged in a fixed manner. When the chip 3 is removed, the chip 3 is heated to reduce the adhesive force of the bonding agent 4 or in case the adhesive force, is low in some degree from the first, the chip 3 is not heated, but is pushed through the hole 2a. Thereby, the chip can be easily removed.
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