发明名称 PRINTED WIRING SUBSTRATE
摘要 PURPOSE:To prevent cracks from occurring, by boring two species of holes different in their diameters from each other when a plurality of pin holes for use in an integrated circuit are bored at prescribed pitches on one straight line. CONSTITUTION:When pin holes for use in an integrated circuit are bored at narrow pitches in a printed wiring substrate 21 in order to make the integrated circuit compact, two species of holes 22A and 22B, which are a little different in their diameters to each other, are alternately bored at prescribed pitches on one straight line. Even if each pitch between their holes is smaller than conventional one, an interval between facing edges of the pin holes 22A and 22B adjacent to each other becomes essentially large accordingly, so that cracks can be prevented from occurring between their pin holes.
申请公布号 JPS63305585(A) 申请公布日期 1988.12.13
申请号 JP19870141206 申请日期 1987.06.05
申请人 OOKUNI SEIKO KK 发明人 SAIGA TADAO
分类号 B26F1/00;H05K1/02;H05K1/11;H05K3/34 主分类号 B26F1/00
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