发明名称 RESIN SEALED SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the breakdown at the root part of a lead terminal, by forming strip shaped machined parts, which are rolled or machined with a knurling tool, at a specified area on the main surface, which is separated outward from the root part of a lead terminal that is taken out of the main body of a resin sealed package. CONSTITUTION:A lead terminal 3 is taken out of a package main body 1 of a resin sealed package. Recesses 10 are formed in the front and rear surfaces of a part, which is separated from a root part 30 of the lead terminal 3 by a certain distance (about 1-3mm) as struck or compressed dents by rolling so that the the inner surface of each dent is gently curved and breakdown strength is not lowered. The recesses 10 are formed as strip shaped machined parts at the specified range (about the width of 3mm). When bending stress is applied to the lead terminal 3, the stress is dispersed to the recesses 10 as the strip shaped machined parts and the parts in the vicinity of the recess parts 10. The parts of the recesses 10 are gently curved.
申请公布号 JPS6414945(A) 申请公布日期 1989.01.19
申请号 JP19870171594 申请日期 1987.07.08
申请人 MITSUBISHI ELECTRIC CORP 发明人 FUJII TOSHIYUKI
分类号 H01L23/48;H01L23/28 主分类号 H01L23/48
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