| 摘要 |
PURPOSE:To simplify the manufacturing process of a multilayered substrate and to lessen the delay of signal propagation by a method wherein a polymethyl pentene film is used as an organic film. CONSTITUTION:A first wiring layer 2 is formed on an alumina substrate 1 using a Cu deposited film of a thickness of 1mum, then a polymethyl pentene polymerized film of a thickness of 3mum is formed by plasma polymerization using 1-methyl-4 pentene as a monomer to use as an insulating layer 3. A KrF excimer laser is irradiated locally on the polymethyl pentene film to form a through hole 4 of a size of 10mum and a second wiring layer 5 is formed using an Au deposited film of a thickness of 1mum to complete a multilayered substrate. |
