| 摘要 |
PURPOSE:To prevent the spring-up of a sheet for array and the peeling of a peripheral semiconductor element from the sheet by installing a lifted and lowered sheet hold-down mechanism for array to the side face section of a die collet. CONSTITUTION:A sheet hold-down jig 2 is mounted onto the side face of a die collet 3, and the hold-down jig 2 is lowered and a sheet 7 for array is pressed when the die collet 3 sucks a semiconductor element 5 on the sheet 7 for array. A pin 8 for pushing up the semiconductor element pushes up the semiconductor element 5, and the element 5 is sucked by the die collet 3. Since the sheet 7 for array is pressed by the sheet hold-down jig 2 at that time, the spring-up of the sheet more than required is prevented, thus obviating the scattering of peripheral semiconductor elements 6. The semiconductor element 5 is sucked by the die collet 3, the sheet hold-down jig 2 is also lifted with the elevation of the die collet 3, and a production device for a semiconductor is returned to an initial state. |
