Thermosetting polyimide resin composition

摘要

A thermosetting polymide resin composition having an excellent molding processing property, heat resistance, low mold shrinkage, and good external appearance of its manufacture which comprises a modified bismaleimide resin prepared by reacting the Michael addition reaction of bismaleimides with aromatic primary diamines and aromatic secondary diamines, an inorganic filler, silicone oil, and a mixed catalyst composed of organic peroxides and imidazoles.