HIGH HEAT-RESISTANT RESIN-SEALING TYPE SEMICONDUCTOR DEVICE

摘要

PURPOSE:To prevent a package from being deformed or cracked due to heating exceeding 200 deg.C when packaging a substrate by using an organic macromolecular adhesive with a specific elasticity modulus of an adhesive-curing substance and a specific rate of moisture absorption under specific conditions. CONSTITUTION:Five kinds of epoxy resins with different composition and a polyimide resin are used as a die-bonding material 10 for adhesion and resin- sealing is performed for production in die bonding of a semiconductor chip 3 on an island 2 of a lead frame, where elasticity modulus of an adhesive-curing agent exceeding 200 deg.C is equal to or larger than 4X10<9>dyn/cm<2> and a rate of moisture absorption after leaving for 72 hours at 85 deg.C/85% R.H. (relative humidity) is equal to 0.2% or smaller.