| 摘要 |
<p>PURPOSE:To increase mounting density by partially cutting out a substrate which is provided with a surface wiring pattern so as to expose an internal layer wiring pattern so that surface mounting parts are mounted on this. CONSTITUTION:A substrate 2 which is provided with a surface wiring patterns 7 and 8 is partially cut out. Through this cut out 12, internal layer wiring patterns 13 and 14 provided on a substrate 3 is exposed. On these internal layer wiring patterns 13 and 14, surface mounting parts 15 are mounted. By this, when compared with the case where surface mounting parts are mounted on a surface wiring pattern, the entire thickness of a printed wiring board which is mounted with parts can be thinner. Further, by soldering a conductor or a mounting parts to the exposed internal wiring pattern and the surface wiring pattern, the surface wiring pattern and the internal layer wiring pattern are connected with each other without providing a through-hole. As a result, mounting density can be increased.</p> |
