Mounting structure for a semiconductor chip having a buffer layer

摘要

A semiconductor device is comprised of glass substrate, an epoxy-phenol resin for buffer means formed on the glass substrate, a set of electrical wiring provided on the epoxy-phenol resin and a semiconductor chip provided with a bump of gold and bonded to the electric wiring with therebetween chip provided with the bump therebetween using a photo-cured type of an epoxy resin.