SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PURPOSE:To flatten a surface of an interlayer insulating film for insulator- isolating upper and lower layer wirings. CONSTITUTION:A lower interconnection layer 6 is provided as a rugged pattern on a semiconductor substrate 1. A silicon series insulating film 7 is so provided on the substrate as to cover the layer 6. A silicon ladder resin film 8 for flattening the surface of the insulting film is buried in a recess of the surface of the film 7. An upper wiring layer 22 to be electrically insulated from the lower wiring layer is provided on the film 8 through a viahole 7C. The constituent group of the film 8 is phenyl group or lower alkyl group and hydrogen atom or lower alkyl group.