| 摘要 |
<p>PURPOSE:To decrease fusing power by providing a resistor layer which is pinched by the first and second heat storage layers and the cross-sectional area of a current circuit is restricted thereon. CONSTITUTION:After a heat storage layer 42 has been formed on the upper surface of a rectangular substrate 10, using the method such as a screen printing and the like, a resistor 30 and electrodes 20 and 21 are formed. Then, a fusing point 30d is formed, and notches 30a, 30b and 30c are provided for adjustment of resistance value. Subsequently, after a heat storage layer 41 has been formed covering the fusing point 30d using the method such as screen printing an the like, an insulating film 40 is coated covering the resistor 30, the upper surface of the electrodes 20 and 21, and the heat storage layer 41 and the like. Then, after base plating has been provided using Ni and the like on the part which is not covered by the insulating film 40 of the electrodes 20 and 21 and the edge surface and the lower surface of the substrate 10, a solder-plating treatment is provided. As a result, a resistance value and a fusing power can be decreased without deterioration of a surge-resisting property.</p> |
