| 摘要 |
<p>PURPOSE:To make firm the bonding between the conductor electrode of Cu baked and a substrate to improve the bonding strength of the electrode by reacting a mixture of Na to be added with the components of glass of glass ceramic substrate upon baking so as to be sintered. CONSTITUTION:In a conductive material made of CuO inorganic compound, CuO is contained by 95.50 to 99.25wt.%, inorganic binder 0.25 to 2.00wt.%, Na mixture 0.50 to 2.50wt.%. A solvent and an organic binder are added thereto to disperse the inorganic components. The Na mixture added reacts with the glass components of glass ceramic substrate upon baking to cause sintering. After the baking the bonding between th conductor electrode and the substrate is thus enhanced to improve the bonding strength of Cu electrode. Since the additive is of Na type, the conductor is bonded to the substrate with less inoganic binder amount than the conventional cases, and hence a solder wetting characteristic is improved after the baking and an excellent electrode to the Cu electrodes is obtained.</p> |
