Arrangement for cooling pressure-contactable power wafer-type semiconductors

摘要

The invention relates to an invention for cooling pressure-contactable power wafer-type semiconductors via water cooling nozzles in which the transmission of heat takes place in an electrically insulated way. In order to provide an arrangement with reduced heat-conduction paths and a reduced number of heat transmission points, which is simple and robust and therefore provides a secure encapsulation, it is proposed according to the invention that the electrical insulation be integrated in the water cooling nozzle and that it form one constructional unit with it. Expediently, the electrical insulation consists of a thermally conductive and electrically highly insulating insulating wafer (6) which is applied directly to a thin termination plate (1) which forms the surface of the cooling nozzle, consists of material which is a good conductor of heat and is mechanically attached, together with a covering pressure element (7), on the cooling nozzle. <IMAGE>