IC CARD AND PRODUCTION METHOD THEREOF.

摘要

The present invention provides an IC card having a construction wherein an IC module (3) is bonded into a first recess (9) of a card substrate (1) by an adhesive (7), and a gap (8) whose upper part is wider but whose lower part is narrower is formed between the inner side surface of recess (9) and outer side surface of the IC module (3), so as to prevent damage to an IC chip inside the module (3) or the card substrate (1) when the card substrate (1) is bent.