Printed circuit board and method thereof

摘要

A printed circuit board and the method of manufacturing the same are provided. The printed circuit board comprises a supporting plate having a front side and a rear side; a first adhesive layer placed on the front side of the supporting plate; and a front wire layer embedded into the first adhesive layer. The front wire layer includes at least one external contact portion for connecting an electronic component, wherein the surface of the external contact portion is coplanar with the surface of the first adhesive layer surrounding the external contact portion.

主权项

1. A method for manufacturing a printed circuit board, comprising:
providing a carrier board; forming a first wire layer on the carrier board, wherein the first wire layer is embossed on a surface of the carrier board and comprises at least one external contact portion for connecting an electronic component; providing a substrate and a first adhesive sheet, wherein the first adhesive sheet is placed between the substrate and the carrier board comprising the first wire layer, and the first wire layer faces the first adhesive sheet, wherein the substrate comprises:
a first conductive layer, a second wire layer, a dielectric layer located between the first conductive layer and the second wire layer, and a cover layer covering the second wire layer, wherein the cover layer faces the first adhesive sheet and combines with the carrier board; and combining the substrate, the first adhesive sheet, and the carrier board including the first wire layer, wherein the first wire layer is embedded into the first adhesive sheet.