发明名称 |
SEMICONDUCTOR DEVICE SILICON WIRE MANUFACTURING METHOD |
摘要 |
forming a silicon layer(24) on the surface of a bottom insulator(22) having a step formed on a semiconductor substrate; forming a photoresist pattern(26) for forming a wire by separating the silicon layer(24) to reveal the silicon layer around the step; injecting oxygen ions into the silicon layer revealed by the photoresist pattern(26); and separating the silicon wire by forming an oxide film(30) by a thermal oxidation of the silicon layer(24) injected with the oxygen ions, after removing the photoresist pattern(26).
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申请公布号 |
KR960016237(B1) |
申请公布日期 |
1996.12.07 |
申请号 |
KR19930018502 |
申请日期 |
1993.09.15 |
申请人 |
HYUNDAI ELECTRONICS IND.CO.,LTD. |
发明人 |
PARK, SUNG-WOOK |
分类号 |
H01L21/768;H01L21/28;H01L23/522;(IPC1-7):H01L21/28 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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