发明名称 SEMICONDUCTOR DEVICE SILICON WIRE MANUFACTURING METHOD
摘要 forming a silicon layer(24) on the surface of a bottom insulator(22) having a step formed on a semiconductor substrate; forming a photoresist pattern(26) for forming a wire by separating the silicon layer(24) to reveal the silicon layer around the step; injecting oxygen ions into the silicon layer revealed by the photoresist pattern(26); and separating the silicon wire by forming an oxide film(30) by a thermal oxidation of the silicon layer(24) injected with the oxygen ions, after removing the photoresist pattern(26).
申请公布号 KR960016237(B1) 申请公布日期 1996.12.07
申请号 KR19930018502 申请日期 1993.09.15
申请人 HYUNDAI ELECTRONICS IND.CO.,LTD. 发明人 PARK, SUNG-WOOK
分类号 H01L21/768;H01L21/28;H01L23/522;(IPC1-7):H01L21/28 主分类号 H01L21/768
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