IC PACKAGE AND MOUNTING STRUCTURE OF IC PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide an IC package and the mounting structure of an IC package which hardly generates a solder bridge between lead terminals. SOLUTION: This IC package is constituted by concaving both side surfaces of each of the lead terminals which are led out in parallel from an IC sealing part 1, toward the central part in the longitudinal direction. The mounting structure consists of the IC package constituted by concaving both side surfaces of each of the lead terminals which are led out in parallel from the IC sealing part 1, toward the central part in the longitudinal direction, and a pad 3 of an electric circuit board. Both side surfaces of the pad 3 are concaved toward the central part in the longitudinal direction. The lead terminals 2 are mounted on the pad 3 in such a manner that the concaved carts coincide with each other.