| 摘要 |
The present invention provides a resin composition that improves the use of the active compound, by controlling exudation of a low vaporizable active compound. A molded product from said resin composition is also provided. The resin composition comprises 100 parts by weight of a resin, 0,01-200 parts by weight of an active compound, and 0,1-100 parts by weight of a vaporizable plasticizer having a vapor pressure of 0,001 mm Hg or higher, at 200 degree C, and vapor pressure (P1) of the vaporizable plasticizer at 20 degree C, and vapor pressure (P2) of the active compound at 20 degree C, being in conformity with formula P1/P2 > -2.
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