| 摘要 |
PURPOSE: To cool even a semiconductor located on the leeward surely by drilling a hole through a wiring board on the leeward of a semiconductor and providing a wind guide for guiding the wind flow on the periphery of semiconductor to the hole on the wiring board. CONSTITUTION: The multichip module comprises a wiring board 1, a semiconductor 2, a wind guide 3, and a radiation fin 5. The semiconductor 2 is mounted on the wiring board 1 and radiation fin 5 is mounted on each semiconductor 2. A hole 4 is made through the board 1 in the direction of thickness on the leeward of semiconductor 2 mounted on the wiring board 1 and the wind guide 3 is mounted on the radiation fin 5. Wind 6 generated by a fan receives heat from the radiation fin 5 and guided, by the wind guide 3, to pass through the hole 4 to the the rear side of semiconductor mounting surface of wiring board 1. Consequently, the radiation fin on the leeward is not subjected directly to the air warmed by the radiation fin on the windward. |
