| 摘要 |
<p>PROBLEM TO BE SOLVED: To make it possible to execute a heat treatment on a sample in a short time by a method wherein a jig for sample support use is constituted of a discal body formed off a material having a heat absorption property, a recessed hole for housing the sample is formed in center of the surface on one side of the surfaces of this discal body and a temperature sensor is secured in a hole formed in some place on the discal body surface on the outside of this recessed hole. SOLUTION: A jig 10 for sample support use is formed into a structure, wherein a semiconductor substrate consisting of silicon is formed into a discal shape and a recessed hole 11 for housing a sample 3 is formed in the surface on one side of the surfaces of the substrate. The shape of this hole 11 is formed in the degree of a shape slightly larger than the outer peripheral shape of the sample 3 and the sample 3 is held in such a way that the outer peripheral surface of the sample 3 is arranged in close proximity to the inner wall surface of the hole 11. Moreover, a small hole is formed in the substrate surface on the outside of this hole 11, a temperature sensor 12 consisting of a thermocouple is inserted in the small hole and the upper part of the sensor 12 is secured with a heat-resisting cement. Thereby, even if the sample is one which is weak to heat, a heat treatment can be executed on the sample 3 in a short time.</p> |
