| 摘要 |
<p>A process for preparing a polyimide-containing polyhydric phenol resin comprising reacting an acid anhydride with a diamine compound in the presence of a polyhydric phenol resin containing two or more phenolic hydroxyl groups per molecule to conduct an imidation reaction while conducting a dehydration reaction; a polyimide-containing polyhydric phenol resin prepared by this process; an epoxy resin composition comprising the polyimide-containing polyhydric phenol resin as a part or the whole of a curing agent component for an epoxy resin; and a cured product thereof. A curing agent for an epoxy resin having excellent heat resistance, high toughness, high adhesion and other excellent properties can be provided without lowering the glass transition temperature and the mechanical strength of the cured product.</p> |
