| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a compsn. with on esp. increased peeling strength to a copper lead frame and without a reflow cracking when applied to a copper lead frame, comprising an epoxy resin, a hardening agent and a filler, and further mixing a specific amt. of an acethylacetone complex salt. SOLUTION: An acetylacetone complex salt in an amt. of 0.01-1.0 pts.wt. is blended with 100 pts.wt., at the total amt of the followings, of an epoxy resin, a hardening agent and a filler. Preferable example is an acetylacetone salt having the formula [wherein M is nickel (II), aluminum, beryllium, chromium(III), cobalt(II), cobalt(III), copper(II), indium(III), iron (II), lithium(I), magnesium (II), manganese(II) or zonc(II)]. Especially preferable ones are aluminum acetylacetonate and copper acetylacetonate. Further, a moisture absorption agent, an adhesion increasing agent, a wettability increasing agent, a defoaming agent, or the like can be appropriately added, as required.</p> |
