| 摘要 |
PROBLEM TO BE SOLVED: To obtain an IC chip package, wherein an irregularity in the heights of a potting resin is eliminated and the accuracy of a potting of IC chips is enhanced and which has a favorable visual form. SOLUTION: In an IC chip packaging structure, which is manufactured by a process for mounting a plurality of IC chips on a multi-plane substrate, a process for mounting integrally formed sealing frames for resin-sealing individually the plurality of the IC chips on the substrate, a process wherein a resin for sealing is fed to the chips and the chips are thermoset, and a process for dividing the chips into individual electronic components (IC packages), eaves protruding parts to overhang toward the insides of the sealing frames are integrally formed on the peripheral edges of the above sealing frames. |
