| 摘要 |
<p>PROBLEM TO BE SOLVED: To ensure a thermal conduction route for dissipating heat from an integrated circuit into the air. SOLUTION: One or more hole 3 for injecting a thermally conductive filler 10 between an integrated circuit 1 and a surface planar conductor 8, a hole 4 for confirming that the thermally conductive filler 10 injected from the injection hole 3 is spread to required regions, and a hole 7 for conducting heat from the integrated circuit 1 through the surface planar conductor 8 to an inner layer planar conductor 17 are provided. Furthermore, a planar conductor 20 for dissipating heat into the air is provided on the outer layer at a part other than the part for mounting the integrated circuit 1 and a through hole 19 for thermally coupling the planar heat dissipating conductor 20 and the inner layer planar conductor 17 are provided. After the integrated circuit 1 is mounted, the gap between the surface planar conductor 8 and the integrated circuit 1 is filled with the thermally conductive filler 10 thus conducting heat from the integrated circuit 1 to the inner layer planar conductor 17.</p> |
