SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To make it possible to firmly bond an electronic component to a metallized layer adhered to a substrate for mounting the electronic component. SOLUTION: A substrate for mounting an electronic component is constituted in a structure that a recessed part is formed almost in the center of the upper surface of he substrate 1 and a metallized layer is formed higher than the center at its peripheral edge on the bottom of the recessed part and is formed under the condition that a difference between the attitudes of the peripheral edge and the center is 3×m or lower and at the same time, the arithmatic mean roughness of the surface of the metallized layer is 1×m or lower, is adhered to the substrate 1.