| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface mounting device and method capable of simultaneously performing the Pick and Place of electronic components on a plurality of printed circuit boards by using movable transfers and conveyers. SOLUTION: This surface mounting device is constituted of X and Y gantries set on a base frame, a plurality of head units set at the prescribed sites of the X and Y gantries, and a component supplying device for supplying components to be mounted on a printed circuit board to be transferred to a component mounting work position. This surface mounting device is provided with a plurality of transfers set so as to be movable in parallel at both the sides of the base frame, a driving means for moving the plurality of transfers, a plurality of conveyers set between the plurality of transfers so as to be movable in the X and Y axial directions, and a plane power transferring device for generating a driving power for moving the plurality of conveyers in the X and Y axial directions. |
