| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for carrying electronic components, capable of taking out a front electronic component from electronic components, such as a chip carried in an alignment state by utilizing an air pressure, without causing problems such as faulty chucking, faulty posture, or the like. SOLUTION: In a pre-state in which a movable shutter 5 starts moving from a component takeoff closing position to a component takeoff opening position, holding force is imparted to the leading electronic component EC, whereby this holding force can be caused to set the leading electronic component EC in a stable state. When the disturbance of attitude and position of the loading electronic component EC occurs at carrying of components, this holding force can be caused to correct the attitude and position of the loading electronic component EC. |
