发明名称 |
APPARATUS FOR TRANSFERRING WAFER |
摘要 |
PURPOSE: An apparatus for transferring a wafer is provided to prevent the damage of a wafer by sensing the generation of an interlock when a wafer is contacted with a section of a blade. CONSTITUTION: A wafer pickup vacuum hole(11) is formed inside a blade(10) of a transfer robot. An interlock sense portion is formed on the blade(10). The interlock sense portion is formed with a lock sense vacuum hole(12), a tension plate(13), and a pressure gauge(20). The lock sense vacuum hole(12) is formed by an additional vacuum line. The tension plate(13) and the pressure gauge(14) are formed on a front end portion and a rear end portion of the lock sense vacuum hole(12). The pressure gauge(14) is used for checking a state of a vacuum pressure of the lock sense vacuum hole(12) and transferring a checked result to an additional controller.
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申请公布号 |
KR20020075671(A) |
申请公布日期 |
2002.10.05 |
申请号 |
KR20010015888 |
申请日期 |
2001.03.27 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, JUN HYEOK |
分类号 |
H01L21/68;(IPC1-7):H01L21/68 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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