POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING RELIEF PATTERN AND ELECTRONIC PARTS

摘要

PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition excellent in photosensitivity characteristics, heat resistance and characteristics of a cured film, to provide a method for manufacturing a pattern by using the composition, and to provide electronic parts for a semiconductor device and a multilayer circuit board with high reliability having an interlayer dielectric or a surface protective film with a favorable relief pattern.

SOLUTION: The positive photosensitive resin composition contains: (A) a polyimide precursor or a polybenzoxazole precursor having an acid decomposable group which increases solubility with an alkali aqueous solution by an acid catalytic reaction; (B) a compound which generates an acid by irradiation of actinic rays; (C) a compound having alcoholic hydroxyl groups with the valency of ≥2; and (D) a solvent. The method for manufacturing a pattern and the electronic parts are disclosed.

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