| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a new contact module whereby a connector can be miniaturized, the contacts can be made highly densely arranged, and impedance matching can be accurately carried out. <P>SOLUTION: This contact module 10 has a base part 12, and a plurality of contacts 14 formed like a comb. The contact module 10 has a structure wherein a base insulating film, a plated film 24, and a cover insulating film 26 are laminated on a sheet 18. The plated film 24 is composed of contacts 24a to 24d and a circuit pattern 24e. A ground contact 14c is in a condition wherein the plated film 24 is brought into contact with a sheet 18 through a slit shaped hole part. <P>COPYRIGHT: (C)2004,JPO |
