发明名称 HEAT-UTILIZATION MATERIAL AND APPLICATION THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide such a heat utilization material belonging to a novel material system that can be utilized in a wide temperature range including a temperature range of 0-150&deg;C. <P>SOLUTION: The heat utilization material comprises a host, which can include a guest to thereby form an inclusion compound, and/or an inclusion compound, which is formed by including the above guest with the above host, with the above host being a salt of a compound and a salt of at least one kind of a compound among its polymers, the compound being expressed by the formula (1): L<SB>m</SB>-A<SB>n</SB>(wherein, L is a basic skeleton such as an unsubstituted or substituted, saturated or unsaturated, linear or branched or cyclic, aliphatic hydrocarbyl group, a 5-memberd or 6-membered cyclic aromatic hydrocarbyl ring, an aromatic heterocyclic single ring, a 2-80 condensed ring group, or the like; (m) is an integer of 1 or more; A is an end group such as cyano group, nitro group, carboxyl group, hydroxy group; (n) is an integer of 1 or more; but the formula (1) contains at least either a hydroxy group or a carboxyl group). Furthermore, a heat reserving material or an adsorbent is formed by this heat utilization material. A thermal storage system contains this heat reserving material. An adsorption heat pump or an air-conditioning system contains this adsorbent. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005220334(A) 申请公布日期 2005.08.18
申请号 JP20040124403 申请日期 2004.04.20
申请人 MITSUBISHI CHEMICALS CORP 发明人 TAKUMI HIDEAKI;KAKIUCHI HIROYUKI;HIDAKA HIDETO;MURAKOSHI AKIKO;ISADA KATSUYA;CHIN KUNI
分类号 F25B17/08;C09K5/06 主分类号 F25B17/08
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